doc. no : qw0905-la16b/h-pf rev. : a date : 19 -oct. - 2005 led array data sheet la16b/h-pf ligitek electronics co.,ltd. property of ligitek only lead-free parts pb
note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without not ice. package dimensions page 1/5 part no. la16b/h-pf ligitek electronics co.,ltd. property of ligitek only lh2640-1-pf + - + - 25.0min 1.0min 2.54typ 0.5 typ 3.3 4.3 1.5max 18.0min 2.54typ 2.9 3.1 1.0min 0.5 typ 2.0 0.5 4.6 6.5 5.08 7.4 3.5
ligitek electronics co.,ltd. property of ligitek only typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. red diffused lens la16b/h-pf red emitted gap part nomaterial color viewing angle 2 1/2 (deg) spectral halfwidth nm peak wave length pnm min. 697901.7 typ. 2.61.8 max.min. 50 4.2 forward voltage @20ma(v) luminous intensity @10ma(mcd) mw 40 pd power dissipation tstg t opr reverse current @5v storage temperature operating temperature ir -40 ~ +100 -40 ~ +85 10 a absolute maximum ratings at ta=25 symbol forward current peak forward current duty 1/10@10khz parameter i f i fp part no. la16b/h-pf ratings 15 60 h ma ma unit page 2/5
r e l a t i v e i n t e n s i t y @ 2 0 m a 600 0.0 0.5 wavelength (nm) 700800900 ambient temperature( ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 1.0 -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 -20 ambient temperature( ) 80 60 40 20 0-40 100 0.0 80 60 02040100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 f o r w a r d c u r r e n t ( m a ) 0.1 1.0 1.0 10 1000 h chip r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a forward voltage(v) 2.03.04.05.01.0 0.0 1.5 1.0 0.5 2.0 2.5 forward current(ma) 101001000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 1000 3/5 page part no. la16b/h-pf
0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to case) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to case) ligitek electronics co.,ltd. property of ligitek only page 4/5 part no. la16b/h-pf 60 seconds max
ligitek electronics co.,ltd. property of ligitek only mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 jis c 7021: b-12 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 1.t.sol=230 5 2.dwell time=5 1sec solderability test this test intended to see soldering well performed or not. the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. high temperature storage test 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test thermal shock test low temperature storage test high temperature high humidity test the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) operating life test test item reliability test: part no. la16b/h-pf this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. test condition description reference standard page 5/5
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